Date of Award
Doctor of Philosophy (PhD)
Bikdash, Dr. Marwan
We established a general, automatic, and versatile procedure to derive an equivalent circuit for a thermal system using temperature data obtained from FE simulations. The EC topology was deduced from the FE mesh using a robust and general graph-partitioning algorithm. The method was shown to yield models that are independent of the boundary conditions for complicated 3D thermal systems such as an electronic chip. The results are strongly correlated with the geometry, and the EC can be extended to yield variable medium-order models. Moreover, a variety of heat sources and boundary conditions can be accommodated, and the EC models are inherently modular. A reliable method to compute thermal resistors connecting different regions was developed. It appropriately averages several estimates of a thermal resistance where each estimate is obtained using data obtained under different boundary or heating conditions. The concept of fictitious heat sources was used to increase the number of simulation datasets. The method was shown to yield models that are independent of the BCs for complicated 2-D thermal systems such as a 2D cavity. A reliable method to compute thermal resistors connecting different regions was developed. In general, the number of regions required for getting an accurate reduced-order model depends on the complexity of the system to be modeled. We have extended the reduced-order modeling procedure to include a view-factor based thermal radiation heat transfer model by including voltage controlled current sources in the equivalent circuit.
Karagol, Serap, "Reduced-Order Equivalent-Circuit Models Of Thermal Systems Including Thermal Radiation" (2011). Dissertations. 137.