Date of Award
Pd-Cu composite membranes on microporous stainless steel substrate (MPSS) were fabricated by novel electroless plating (EP process. In conventional Pd-EP process, the oxidation-reduction reactions between Pd-complex and hydrazine result in evolution of NH3 and N2 gas bubbles. When adhering to a substrate surface and in the pores, these gas bubbles can hinder uniform Pd-film deposition, which results in dendrite growth leading to poor film formation. We addressed this problem by introducing cationic surfactant in the electroless plating process known as surfactant induced electroless plating (SIEP).
Islam, Md. Saiful, "Fabrication Of Pd-Cu Membranes By Surfactant Induced Electroless Plating (Siep)" (2011). Theses. 42.