Date of Award
2011
Document Type
Thesis
First Advisor
Ilias, Shamsuddin
Abstract
Pd-Cu composite membranes on microporous stainless steel substrate (MPSS) were fabricated by novel electroless plating (EP process. In conventional Pd-EP process, the oxidation-reduction reactions between Pd-complex and hydrazine result in evolution of NH3 and N2 gas bubbles. When adhering to a substrate surface and in the pores, these gas bubbles can hinder uniform Pd-film deposition, which results in dendrite growth leading to poor film formation. We addressed this problem by introducing cationic surfactant in the electroless plating process known as surfactant induced electroless plating (SIEP).
Recommended Citation
Islam, Md. Saiful, "Fabrication Of Pd-Cu Membranes By Surfactant Induced Electroless Plating (Siep)" (2011). Theses. 42.
https://digital.library.ncat.edu/theses/42